Sign In | Join Free | My tjskl.org.cn
China Bicheng Electronics Technology Co., Ltd logo
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Verified Supplier

5 Years
Home > Rogers PCB Board >

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Product Categories
Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Brand Name : Bicheng

Model Number : BIC-123.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Ceramic-filled Laminates Reinforced with Woven Fiberglass

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB thickness : 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, OSP etc..

Contact Now

Rogers RO3203 Double Sided 30mil High Frequency PCB With Green Mask For Wireless Telecommunications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using

standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

Features:

1. Woven glass reinforcement improves rigidity for easier handling.

2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.

4. Surface smoothness allows for finer line etching tolerances

Typical Applications:

1. Base Station Infrastructure

2. Remote Meter Readers

3. Wireless Telecommunications Systems

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518
Volume Resistivity 107 MΩ.cm A ASTM D257
Surface Resistivity 107 MΩ A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500 ℃ TGA ASTM D3850
Density 2.1 gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes


Product Tags:

30mil Printed Circuit Boards

      

Wireless Telecommunications Rogers PCB Board

      

RO3203 Printed Circuit Boards

      
Quality Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards for sale

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like